As a key component to ensure the safe grounding of the electrical system, the surface treatment of the grounding card is crucial, which is not only related to the appearance, but also has a profound impact on the performance.
First, galvanizing is a common and effective method. A layer of zinc is plated on the surface of the grounding card through electrogalvanizing or hot-dip galvanizing. This layer of zinc film is like a solid shield, providing excellent corrosion resistance for the grounding card, allowing it to serve for a long time in harsh environments such as moisture, acid and alkali. Taking the grounding card in outdoor electrical equipment as an example, after galvanizing, its corrosion resistance is greatly extended, effectively avoiding the degradation of grounding performance due to rust, and ensuring the continuous reliability of grounding. At the same time, the uniform coverage of the zinc layer can also fill in small surface defects to a certain extent, making the appearance of the grounding card smoother and brighter.
Secondly, nickel plating has unique advantages. Nickel plating can give the grounding card better wear resistance. In the scenario of frequent installation, disassembly or external friction, the nickel layer effectively protects the base metal from wear and maintains the structural integrity of the grounding card. Moreover, nickel has good chemical stability and can resist corrosion from some special chemical media. For grounding cards used in special environments such as chemical workshops, nickel plating ensures stable performance and prevents failure due to chemical corrosion.
Furthermore, passivation treatment should not be underestimated. It uses chemical agents to form a dense passivation film on the surface of the grounding card. Although this film is very thin, it can greatly enhance the anti-oxidation ability of the metal surface, prevent oxygen from directly contacting the metal, and slow down the oxidation and rusting process. For some grounding cards in short-term inventory or light use environments, the passivation treatment cost is low and can meet basic protection needs to ensure that its initial performance is not damaged.
From the perspective of conductive performance, some surface treatment methods need to be carefully weighed. For example, although some organic coatings can provide excellent anti-corrosion and decorative effects, due to their insulating properties, if the coating is too thick or uneven, it may hinder current conduction and reduce the conductive efficiency of the grounding card. Therefore, the coating parameters must be strictly controlled during application to ensure smooth grounding.
In addition, the process quality control of surface treatment is extremely critical. Whether it is the current density and temperature in the electroplating process, or the operating specifications of passivation and coating, any error in any link may lead to problems such as poor film adhesion and uneven thickness, which not only fail to achieve the purpose of protection, but may also peel off prematurely, affecting the normal use of the grounding card.
Through performance testing of grounding cards with different surface treatments, it is found that the reasonable selection and strict implementation of surface treatment processes can comprehensively improve the corrosion resistance, wear resistance, and oxidation resistance of grounding cards, ensure their stability and reliability under various complex working conditions, and lay a solid foundation for the safe operation of electrical systems.
