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How to prevent corrosion during the use of metal stamping grounding cards?

Publish Time: 2025-04-03
It is very important to prevent corrosion during the use of metal stamping grounding cards, which is related to the reliability of the grounding system and the safe operation of the equipment.

1. Choose the right metal material

Corrosion-resistant materials: metal materials with good corrosion resistance, such as stainless steel, copper alloy, etc., are preferred. These materials can still maintain good stability in harsh environments such as moisture, acid and alkali.

Avoid contact between dissimilar metals: grounding cards should avoid using different metal materials, including vertical grounding electrodes, ground leads, etc., to prevent galvanic corrosion.

2. Surface treatment technology

Coating protection: Apply, spray or electroplate a layer of corrosion-resistant material, such as paint, plastic, ceramic or metal plating (such as zinc plating, nickel plating, etc.) on the surface of the grounding card to form a protective layer to isolate the metal from the external corrosive medium.

Anodizing: For some aluminum alloy grounding cards, anodizing can be used to form a dense oxide film to improve corrosion resistance.

3. Electrochemical protection

Cathode protection: By applying an external current, the grounding card becomes a cathode, thereby slowing down or preventing corrosion. This method is particularly suitable for occasions such as underground or underwater where surface treatment is difficult.

4. Improve design and process

Optimize structural design: In the design of the grounding card, structural design that reduces stress concentration and avoids local corrosion should be considered. For example, for the neutral point grounding of the transformer, it is necessary to consider adding a deep-buried vertical grounding electrode.

Improve construction technology: Use welding and other connection methods to avoid bolting and crimping to reduce the risk of crevice corrosion and galvanic corrosion. At the same time, the welding reaction is completed in the melt, the appearance and shape of the joint are uniform and full, the quality can be controlled, and local corrosion caused by uneven external structure can be reduced.

5. Corrosion monitoring and maintenance

Regular monitoring: Regularly monitor the corrosion of the grounding card, including appearance inspection, thickness measurement, etc., to promptly detect and deal with corrosion problems.

Maintenance management: Establish a maintenance management system for the grounding card, regularly clean the dirt and corrosion products on the surface, and keep its surface clean and dry. For grounding cards that have been corroded, they should be replaced or repaired in time.

6. Environmental control

Control soil characteristics: Before installing the grounding card, the electrochemical characteristics of the soil should be evaluated, and necessary control measures should be taken, such as the selection and control of the backfill soil, to reduce corrosion damage.

Add corrosion inhibitors: Adding corrosion inhibitors to the corrosive medium can slow down the corrosion rate of the grounding card. However, attention should be paid to the selection and use conditions of the corrosion inhibitor to avoid adverse effects on the environment and equipment.

In summary, the anti-corrosion measures for metal stamping grounding cards need to be comprehensively considered from multiple aspects such as material selection, surface treatment technology, electrochemical protection, design process, corrosion monitoring and maintenance, and environmental control. By taking these measures, the service life of the grounding card can be effectively extended to ensure the reliability of the grounding system and the safe operation of the equipment.
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